Evaluating the Effectiveness of Shea Butter Cake (SBC) as an Earth-Grounding Material Compared to Alternative Conductive Backfills


  • Williams Brobbey Tutor, Department of Technical Education, College of Education, Ada, Ghana
  • Cynthia Twumasi Tutor, Department of Vocational Education, College of Education, Bechem, Ghana




earthing system, electrical grounding systems, conductive backfills, shea butter cake, electrical conductivity, local soil


Electrical grounding systems play a crucial role in ensuring the safety and reliability of electrical installations and protecting equipment and personnel from electrical faults, surges, and lightning strikes. Conductive backfills are essential components of these systems, providing low-resistance pathways for the dissipation of electrical energy. This study mainly evaluates the effectiveness of shea butter cake (SBC) as an earth-grounding material compared to alternative conductive backfills. The study adopted an experimental design utilizing a Fall-of-potential" approach in investigating the problem. Shea butter residues, the experimental subject, serve as the thesis' principal source of information. Three (3) distinct types of sampled materials were prepared for testing. (a) local soil (reference experiment); (b) local soil with shea butter residues; and (c) local soil with shea butter residues and clay. It was discovered that the local soil's conductivity had less resistance to electrical flow when it was wet than when it was dry. The conductivity of soil depends on moisture content with variation on the kind of liquid present and the soil resistivity is influenced by the temperature, moisture content, and soil composition. The researcher suggests that Shea butter residue should be encouraged to be used in the country as it is economically cheap when compared to other grounding materials and also it is worthy of carrying out the backfills.


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How to Cite

W. Brobbey and C. Twumasi, “Evaluating the Effectiveness of Shea Butter Cake (SBC) as an Earth-Grounding Material Compared to Alternative Conductive Backfills”, IJRESM, vol. 7, no. 6, pp. 94–99, Jun. 2024, doi: 10.5281/zenodo.11973189.