An Analytical Study of the Thermal Behaviour of Epoxy Resins Containing Boron Nitride
Keywords:Boron nitride, Differential scanning calorimetry (DSC), Epoxy, Thermal conductivity, Thiol
An epoxy-thiolic system filled with boron nitride (BN) in the shape of 80 m agglomerates has been tested in order to achieve better thermal conductivity. The effect of BN content on cure reaction kinetics was evaluated by differential calorimetric scanning (DSC) and the thermal conductivity of the healed samples was calculated by a temporary hot bridge check. The reaction heat and the glass transition temperature of the fully cured samples are both independent of the BN content, while the cure reaction kinetics is not: with a rise in BN content, the reaction first occurs and then is delayed, this activity is more apparent than with the same system with 6 m BN particles that was previously tested.
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Copyright (c) 2020 Akash Pandey, Amit Kumar Yadav
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