An Analytical Study of the Thermal Behaviour of Epoxy Resins Containing Boron Nitride

Authors

  • Akash Pandey Student, Department of Mechanical Engineering, IEC College of Engineering & Technology, Greater Noida, India
  • Amit Kumar Yadav Professor, Department of Mechanical Engineering, IEC College of Engineering & Technology, Greater Noida,

Keywords:

Boron nitride, Differential scanning calorimetry (DSC), Epoxy, Thermal conductivity, Thiol

Abstract

An epoxy-thiolic system filled with boron nitride (BN) in the shape of 80 m agglomerates has been tested in order to achieve better thermal conductivity. The effect of BN content on cure reaction kinetics was evaluated by differential calorimetric scanning (DSC) and the thermal conductivity of the healed samples was calculated by a temporary hot bridge check. The reaction heat and the glass transition temperature of the fully cured samples are both independent of the BN content, while the cure reaction kinetics is not: with a rise in BN content, the reaction first occurs and then is delayed, this activity is more apparent than with the same system with 6 m BN particles that was previously tested.

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Published

03-08-2020

Issue

Vol. 3 No. 8 (2020)

Section

Articles

License

Copyright (c) 2020 Akash Pandey, Amit Kumar Yadav

Creative Commons License

This work is licensed under a Creative Commons Attribution 4.0 International License.

How to Cite

[1]
A. Pandey and A. K. Yadav, “An Analytical Study of the Thermal Behaviour of Epoxy Resins Containing Boron Nitride”, IJRESM, vol. 3, no. 8, pp. 17–20, Aug. 2020, Accessed: Nov. 21, 2024. [Online]. Available: https://journal.ijresm.com/index.php/ijresm/article/view/113